After dismantling the elements can not be returned, such as chip, north and south bridge, storage chip, integrated circuits,field-effect plastic components are the highest collective material containing gold and silver meets element unified treatment, can use ozone roasting (ozone can completely destroy the formation of harmful combustion smoke), roasting residue using soluble carrier, leaching of copper, tin, gold platinum palladium hydrochloric acid leaching medium, extraction of gold,platinum and palladium.The chip capacitors highly contain silver-palladium-containing separate with highly acid method independent refining silver palladium, for the gold-plated silver circuit board, plug ammonium polysulfide recommend using non-toxic methods to extract gold and silver plated quick retreat.For the silver-containing and palladium surface acoustic, metal packaging transistors, integrated circuits with special cutting machine pin chips were cut out of the metal case a chip,an integrated circuit solution to extract the valuable metals containing aluminum electrolytic capacitor for high-rolling after the dry,after crushing the direct smelting of aluminum metal, for Zener diode, varactor part, such as glass sealing components, plastic light-emitting tube was refine valuable metals after compacted crushed, for circuit board use acid leaching then by liquid electrolysis produce electrolytic copper, palladium-containing circuit boards (double-sided circuit board containing basic palladium,palladium as copper substrate contained in a wire guide hole) reuse acid leaching of palladium, and then extract palladium.