Many waste materials contain precious metals such as gold, silver, platinum, and palladium, but the content varies. Common waste materials with high precious metal content and extraction value include: waste electronic circuit boards, such as used computer boards, telecommunications boards, VCD boards, and TV boards.
Various gold-plated components, such as aviation connectors, gold-plated plugs in various electrical appliances, gold-plated electronic components, electronic feet, and gold-plated handicrafts. Various electroplating wastewater and sludge containing precious metals.
Waste circuit boards are automatically dismantled into tin dross, metal parts, electrolytic capacitors, integrated circuit chips, surface-mount capacitors, plastic packages, CPUs and memory, and motherboards. Tin dross and metal parts can be sold directly, while electrolytic capacitors are separated into aluminum powder and plastic powder by capacitor recycling equipment, which also have high utilization value. Using carbonization furnaces and precious metal sorting and refining equipment, heavy metals such as platinum, palladium, gold, silver, and copper can be extracted from integrated circuit chips and surface-mount capacitors. The recycling value of waste circuit boards is very high.
The precious metal sorting and refining production line is used to sort and refine precious metals such as gold, silver, palladium, and platinum from electronic waste containing precious metal chip components and anode mud. Materials with the highest gold and silver content are classified according to unified processing standards and can be used for ozone baking (ozone can completely destroy harmful fumes produced by combustion). Platinum and palladium are extracted, as are gold, platinum, and palladium. For chip capacitors with high silver and palladium content, an acid method is used to extract silver and palladium separately.
For acoustic surfaces containing silver and palladium, metal-encapsulated transistors, and integrated circuits, a special cutting machine is used to remove the metal casing and stamp out the chip. Precious metals are then extracted based on the principles of chip and integrated circuit production. After crushing, aluminum is directly smelted. For Zener diodes, some varactor diodes, other glass-sealed components, and plastic-sealed LEDs, precious metals are extracted after crushing. Palladium is produced by electrolytic copper production. For palladium-containing circuit boards (double-sided circuit boards generally contain palladium, which is used as a copper-plated substrate and fills conductive holes used as conductors), palladium is leached with acid and then extracted.
